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 September 2006 rev 0.3 Nine Output 3.3V Buffer
Features Functional Description
One-input to Nine-Output Buffer/Driver Supports two DIMMs or four SO-DIMMs with one additional output for feedback to an external or chipset PLL Low power consumption for mobile applications Less than 32mA at 66.6MHz with unloaded outputs 1nS Input-Output delay Buffers all frequencies from DC to 133.33MHz Output-output skew less than 250pS Multiple VDD and VSS pins for noise and electromagnetic interference (EMI) reduction Space-saving 16 pin 150 mil SOIC Package 3.3V operation Commercial and Industrial temperature parts are available
PCS2P2309NZ
The PCS2P2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. The part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The device operates at 3.3V and outputs can run up to 133.33MHz. The PCS2P2309NZ is designed for low EMI and power optimization. It has multiple VSS and VDD pins for noise optimization and consumes less than 32mA at 66.6MHz, making it ideal for the low-power requirements of mobile systems. It is available in an ultra-compact 150 mil 16 pin SOIC Package.
Block Diagram
BUF_IN OUTPUT1 OUTPUT2 OUTPUT3 OUTPUT4 OUTPUT5 OUTPUT6 OUTPUT7 OUTPUT8 OUTPUT9
PulseCore Semiconductor 1715,S.Bascom Avenue,Suite200,Campbell,CA 95008* Tel: 408-879-9077 * Fax: 408-8879-9018 * www.pulsecoresemi.com
Notice: The information in this document is subject to change without notice.
September 2006 rev 0.3
Pin Configuration
BUF_IN OUTPUT1 OUTPUT2 VDD GND 1 2 3 4 5 PCS2P2309NZ 16 15 14 13 12 11 10 9 OUTPUT9 OUTPUT8 OUTPUT7 VDD GND OUTPUT6 OUTPUT5 GND
PCS2P2309NZ
OUTPUT3 6 OUTPUT4 VDD 7 8
Pin Description Pin
4, 8, 13 5, 9, 12 1 2, 3, 6, 7, 10, 11, 14, 15, 16 VDD GND BUF_IN OUTPUT [1:9]
Signal
Ground Input Clock Outputs
Description
3.3V Digital Voltage Supply
Nine Output 3.3V Buffer
Notice: The information in this document is subject to change without notice.
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September 2006 rev 0.3
Absolute Maximum Ratings Symbol
VDD, VIN TSTG TA Ts TJ TDV Storage temperature Operating temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B)
PCS2P2309NZ
Parameter
Voltage on any pin with respect to Ground
Rating
-0.5 to +4.6 -65 to +125 -40 to +85 260 150 2
Unit
V C C C C KV
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability.
Operating Conditions Parameter
VDD TA CL CIN BUF_IN, OUTPUT [1:9] tPU Supply Voltage (Ambient Operating Temperature), Commercial (Ambient Operating Temperature), Industrial Load Capacitance, Fout < 100MHz Load Capacitance,100MHz < Fout < 133.33MHz Input Capacitance Operating Frequency Power-up time for all VDD's to reach minimum specified voltage (power ramps must be monotonic)
Description
Min
3.0 0 -40 DC 0.05
Max
3.6 70 85 30 15 7 133.33 50
Unit
V C C pF pF pF MHz mS
Nine Output 3.3V Buffer
Notice: The information in this document is subject to change without notice.
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September 2006 rev 0.3
Electrical Characteristics for Commercial and Industrial Temperature Devices Parameter
VIL VIH IIL IIH VOL VOH IDD
PCS2P2309NZ
Description
Input LOW Voltage1 Input HIGH Voltage
1
Test Conditions
Min
2.0
Max
0.8 50.0 100.0 0.4 32
Unit
V V A A V V mA
Input LOW Current Input HIGH Current Output LOW Voltage2 Output HIGH Voltage2 Supply Current
VIN = 0V VIN= VDD IOL= 8 mA IOH = -8 mA Unloaded outputs at 66.66MHz
2.4 -
Switching Characteristics for Commercial and Industrial Temperature Devices3 Parameter
tD t3 t4 t5 t6
Name
Duty Cycle2= t2 /t1 Rise Time2 Fall Time2 Output to Output Skew
2
Description
Measured at 1.4V Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V All outputs equally loaded Measured at VDD/2
Min
40.0 1
Typ
50.0 5
Max
60.0 1.50 1.50 250 9.2
Unit
% nS nS pS nS
Propagation Delay, BUF_IN Rising Edge to 2 OUTPUT Rising Edge
Note: 1. BUF_IN input has a threshold voltage of VDD/2. 2. Parameter is guaranteed by design and characterization. It is not 100% tested in production. 3. All parameters specified with loaded outputs.
Nine Output 3.3V Buffer
Notice: The information in this document is subject to change without notice.
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September 2006 rev 0.3
Switching Waveforms Duty Cycle Timing
PCS2P2309NZ
All Outputs Rise/Fall Time
Output-Output Skew
Input-Output Propagation Delay
Nine Output 3.3V Buffer
Notice: The information in this document is subject to change without notice.
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September 2006 rev 0.3
Test Circuits
PCS2P2309NZ
+3.3V
TEST CIRCUIT VDD 0.1uF OUTPUT CLKOUT LOAD VDD 0.1uF GND
+3.3V
Nine Output 3.3V Buffer
Notice: The information in this document is subject to change without notice.
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September 2006 rev 0.3
Package Information 16-lead (150 Mil) Molded SOIC
PCS2P2309NZ
8
1
PIN 1 ID
E
H
9 D
16 Seating Plane A e
B
h
A2
D
0.004
L
C
A1
Dimensions Symbol Min
A A1 A2 B C D E e H h L 0.228 0.010 0.016 0 0.053 0.004 0.049 0.013 0.008 0.386 0.150 0.050 BSC 0.244 0.016 0.035 8 5.80 0.25 0.40 0
Inches Max
0.069 0.010 0.059 0.022 0.012 0.394 0.157
Millimeters Min
1.35 0.10 1.25 0.33 0.19 9.80 3.80 1.27 BSC 6.20 0.41 0.89 8
Max
1.75 0.25 1.50 0.53 0.27 10.01 4.00
Nine Output 3.3V Buffer
Notice: The information in this document is subject to change without notice.
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September 2006 rev 0.3
Ordering Codes Part Number
PCS2P2309NZF-16-ST PCS2P2309NZF-16-SR PCS2I2309NZF-16-ST PCS2I2309NZF-16-SR PCS2P2309NZG-16-ST PCS2P2309NZG-16-SR PCS2I2309NZG-16-ST PCS2I2309NZG-16-SR
PCS2P2309NZ
Marking
2P2309NZF 2P2309NZF 2I2309NZF 2I2309NZF 2P2309NZG 2P2309NZG 2I2309NZG 2I2309NZG
Package Type
16-pin 150-mil SOIC, Pb Free 16-pin 150-mil SOIC, Tape and Reel, Pb Free 16-pin 150-mil SOIC, Pb Free 16-pin 150-mil SOIC, Tape and Reel, Pb Free 16-pin 150-mil SOIC, Green 16-pin 150-mil SOIC, Tape and Reel, Green 16-pin 150-mil SOIC, Green 16-pin 150-mil SOIC ,Tape and Reel, Green
Temperature
Commercial Commercial Industrial Industrial Commercial Commercial Industrial Industrial
Device Ordering Information
PCS2P2309NZ
F-16-SR
R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70
PulseCore Semiconductor Mixed Signal Product
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
Nine Output 3.3V Buffer
Notice: The information in this document is subject to change without notice.
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September 2006 rev 0.3
PCS2P2309NZ
PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com
Copyright (c) PulseCore Semiconductor All Rights Reserved Part Number: PCS2P2309NZ Document Version: 0.3
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003
(c) Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore's best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore's Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore's Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.
Nine Output 3.3V Buffer
Notice: The information in this document is subject to change without notice.
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